Cure device
Cure device
The cure device is a clean cure apparatus that overheats the lead frame after die bonding from both the top and bottom while purging with N2 hot gas simultaneously. This equipment automatically performs a series of operations from directly receiving the lead frame from the die bonder to feeding it into the cure furnace, storing it in a magazine, and discharging the magazine.
- Company：双葉機工
- Price：Other
